Network-on-Chip (NoC) interconnect technology leader enables higher performance and more cost effective designs for mobile phone systems-on-chip (SoCs).

Arteris Inc., a leading supplier of network-on-chip (NoC) based interconnect IP solutions, today announced that Samsung Electronics Co., Ltd has selected Arteris’ interconnect solutions for multiple chips within Samsung’s mobile SoC products. Samsung chose Arteris interconnect IP to support the high speed inter-chip communication requirements in next generation mobile SoC products.

Arteris IP enables high bandwidth inter-chip communication at lower power, allowing mobile devices such as smartphones to extend their battery life.

The Arteris interconnect IP offers us a convenient solution to handle the high speed communication needed between our SoC and external modem IC. Our customers will benefit from the lower BOM cost and power consumption as a result of this IP ,” said Thomas Kim, vice president, SoC Platform Development, System LSI , Samsung Electronics. “We look forward to Arteris’ interconnect IP helping us shorten development schedules and lower risks associated with compatibility.

Samsung’s decision to adopt Arteris technology is a very significant deployment of our solutions,” said K. Charles Janac, President and CEO of Arteris. “The ability of our solution to ease the communication within mobile phones delivers significant cost and performance benefits, all while operating at lower power.”

About Arteris
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate Systemon- Chip semiconductor (SoC) assembly for a wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs.

Founded by networking experts, Arteris operates globally with headquarters in San Jose, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech.
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