Arteris, Inc. and Tensilica,® Inc. today announced that Arteris’ Network-on-Chip (NoC) technology for on-chip communications now fully supports Tensilica’s Xtensa® Processor Interface (PIF). This support will make it much easier for designers to get maximum efficiency when integrating Tensilica’s dataplane processing units (DPUs) into their system-on-chip (SOC) designs. Using Arteris’ NoC technology, Tensilica’s DPUs can be mixed and matched with other processor cores or RTL blocks in complex, highthroughput designs. Tensilica’s DPUs are often used in multi-core chip designs, performing valuable data processing functions such as audio, video and baseband communications.
“Arteris’ Network-on-Chip technology is valuable for designers trying to integrate different functions and facing limitations on the number of resources that can effectively share a bus,” stated Chris Jones, Tensilica’s director of product marketing. “Now, with Arteris’ out-of-thebox support for the Xtensa PIF, our customers can quickly define a high-performance interconnect of multiple Xtensa processors.”
“By adding native Tensilica support, we’re broadening the number of processor cores we can effectively support with our NoC technology,” stated Charlie Janac, president and CEO of Arteris. “The interconnect design is the key component of the SOC integration, and the more flexible the options available to the designer, the better the resulting SOC design.”
Support for the Arteris NoC adds to the already impressive number of interconnect options for Xtensa processors, from the user configurable PIF, to industry standard AMBA buses, to novel, high performance, user-defined, point-to-point queue interfaces.
Arteris, Inc. provides semiconductor interconnect IP and tools to improve communication performance of ICs for a wide range of applications. Results obtained by using Arteris IP product line include lower power, higher performance, efficiency of development and faster delivery of simple to complex ICs, SoCs and FPGAs.
Founded by networking experts, Arteris operates globally with headquarters in San Jose, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, , and Ventech. More information can be found at www.arteris.com.
Tensilica, Inc. is the leader in customizable dataplane processors IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10 to100x the performance because they can be customized using Tensilica’s automated design tools to meet specific signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and five out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.
· Tensilica and Xtensa are registered trademarks belonging to Tensilica Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective
· Tensilica’s announced licensees include: ADDMM, Afa Technologies, ALPS, Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay Microsystems, Blue Wonder, Brocade, Broadcom, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, DS2, EE Solutions, Epson, ETRI, FUJIFILM Microdevices, Fujitsu Ltd., Fujitsu Microelectronics Ltd., the HiSilicon division of Huawei, Hudson Soft, iBiquity Digital, Ikanos Communications, IDT, Intel, Juniper Networks, LG Electronics,Lucid Information Technology, Marvell, NEC Laboratories America, NEC Corporation, Neterion, Nethra Imaging, Nippon Telephone and Telegraph (NTT), NuFront, NVIDIA, Olympus Optical Co. Ltd.,Panasonic Mobile, Penstar, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Samsung, SiBEAM, Sony, STMicroelectronics, Stretch, Telegent Systems, TranSwitch Corporation, Triductor Technology, UpZide, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), WiLinx, Wolfson Microelectronics, and XM Radio.